Assistant Prof. Dr.

Istanbul Technical University

School of Computer Engineering and Informatics

ITU Ayazağa/Maslak


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Ph.D., Electrical Engineering, Georgia Institute of Technology, Atlanta, Georgia, May 2004, GPA: 3.76/4.00

Thesis: Statistical Design, Analysis, and Diagnosis of Digital Systems and Embedded RF Circuits


MS, Electrical Engineering, Georgia Institute of Technology, Atlanta, Georgia, Dec 2000, GPA: 3.70/4.00

Major: Electromagnetics and Electronic Design


BS, Electrical Engineering, Middle East Technical University, Ankara, Turkey, June 1999, GPA: 3.76/4.00

Major: Computer Architecture and Microelectronics


Journal Publications

Conference Proceedings


Book Chapter

Ph.D. Thesis


Dr. Erdem Matoglu received his MSc and PhD degrees from Georgia Institute of Technology. During his graduate studies he worked on electronic systems design and packaging issues of high-frequency digital and RF systems. He developed statistical methods to improve understanding and increase efficiency in the design of high data rate computer interfaces. Following graduation he joined IBM Systems and Technology Division x-Series Server Development Group in Austin, TX. He worked there for five years, taking part in Intel and AMD based IBM x-Series server designs. He implemented the results of his PhD dissertation on the signal integrity and power integrity issues of high frequency interfaces, resulting in improvements in design cycle and product quality. As a result of his work and the patents he contributed, he was promoted to Senior Engineer/Scientist and reached the 3th IBM Invention plateau. The statistical practices he published are currently implemented by IBM, Intel, Dell, and AMD signal and power integrity design engineering.

In 2009 he moved to Istanbul and joined Hittite Microwave Corporation Istanbul Design Center, at the ITU Technopark. At Hittite, his research was on RF and digital transmission technology. Some of the research projects he completed include development of modelling techniques for LNA noise parameters, implementation of quadrature modulation test boards and methodologies, and improvements on wideband power detector sensitivity.

In 2011and 2012, he taught at the Istanbul Technical University, School of Computing and Informatics.

In August 2012, he joined Amphenol Corporation, High Speed Interconnects Division in Nashua, New Hampshire, USA.


Research Interests:

·         High-frequency digital data transmission in copper, fiber-optic, and wireless environments

·         Signal Integrity and Power Integrity issues of high-frequency digital systems

·         Implementation of high-frequency digital and RF systems




08/2012 – Present       Amphenol Corporation, Nashua, NH, USA

Senior Signal Integrity Engineer


Design, development, and manufacturing of high speed cable, connector, backplane solutions for 100G Ethernet, Infiniband FDR & EDR, Fibre Channel, Serial Attached SCSI


09/2011 – 07/2012      Istanbul Technical University, School of Computer Engineering and Informatics

Assistant Prof. Dr.                 


02/2009 – 08/2011      Hittite Microwave Corporation (NASDAQ:HITT), Istanbul Design Center

Senior Engineer


Working on development, bring-up, test, and verification of digital and RF hardware components for wireless and fiber-optic communication technologies


  • Developed engineering solutions for digital, RF, and mixed signal system challenges.
  • Worked on development, bring-up, test and verification of up/down conversion components, modulators, de-modulators, mixers, LNA’s, variable attenuators, power detectors, fiber-optic laser modulator drivers, and fiber-optic clock chain applications.  
  • Designed digital calibration hardware for quadrature modulator products.
  • Designed extended range power detector modules.
  • Designed fiber-optic modulator driver, and clock chain modules.
  • Prepared implementation and user documentations to support complex products and systems
  • Provided engineering support to customers, business development, and sales teams to increase revenue and market share



02/2004 – 01/2009                  IBM Corporation, Austin, TX

Senior Engineer, Systems &Technology Group, System x Server Development


Worked in the design and development of high performance IBM server systems


  • Responsible for signal and power integrity of the electrical interfaces for IBM System x products at package and board level
  • Verified electrical specification compliance through design and measurements
  • Conducted feasibility and interface performance analysis for the concept designs
  • Generated physical implementation guidelines
  • Directed physical board and electronic package designs of the computer system
  • Derived design guidelines of critical electrical interfaces for Intel and AMD based high-end System x and BladeCenter servers
    • Involved in the design and development of IBM System x servers: x3755, x3655, x3455, x260, x360, x460, x366, and BladeCenter server systems
  • Worked on the implementation of processor interfaces: HyperTransport and FSB; Memory interfaces: DDR, DDR2, and FBD; Storage interfaces: SAS and SATA; Peripheral interfaces: PCIE and PCIX; Scalability interfaces: IBM HSS
  • Developed statistical analysis and diagnosis methods to evaluate high-speed electrical performance, find worst-case corners, and optimize the design
  • Worked on power delivery design, decoupling capacitor optimization, simultaneous switching noise reduction for electronic components
  • 8 US Patents and 3 internal IBM publications



08/1999 - 12/2003                   Georgia Institute of Technology, Atlanta, GA

Research Assistant, Packaging Research Center

  • Developed statistical methodologies relating manufacturing variations of printed circuit board and packaging structures to electrical signal and power integrity performance
  • Designed high-speed source synchronous test boards for transmission, bandwidth, and signal integrity research
  • Developed and optimized models, simulations, and measurements for electrical characterization of chip and system level packages


05/2002 - 08/2002                   IBM Corporation, Austin, Texas

Co-op Assignment

  • Worked on power and signal integrity modeling, simulation, verification, and measurement of IBM System x server memory cards and PCI-X ports
  • Developed and implemented a statistical approach for signal integrity analysis and failure diagnosis
  • Participated in development and hardware de-bugging


05/2001 - 08/2001                   IBM Corporation, Austin, TX

Co-op Assignment

  • Worked on signal and power integrity modeling and simulation of IBM System x server Intel Front Side Bus
  • Modeled and analyzed simultaneous switching noise and power plane bounce
  • Performed system level simulations to optimize the amount and location of decoupling capacitors
  • Simulated high frequency plane resonance for large server boards


06/1998 - 08/1998                   Middle East Technical University, Ankara, Turkey

Internship VLSI Design Group

  • Learned basic VLSI design
  • Worked on analog CMOS sensor readout circuits


06/1997 - 08/1997                   ASELSAN Electronics Company, Electro-optics Division, Ankara, Turkey


  • Studied infrared imaging and various night vision techniques




  • Co-inventor of  8 US Patents and 3 internal IBM publications
  • Authored and co-authored 34 IEEE indexed publications
  • Intel Best Student Paper Award at IEEE EPEP 2002 Conference.



  • Used various test and measurement equipment for time and frequency domain characterization

Oscilloscopes, Time Domain Reflectometry (TDR), Vector Network Analyzer (VNA), Spectrum Analyzer, Signal Generators, etc…

  • Engineering Software: Cadence Allegro PCB Editor/Constraint Manager/SigXp, HSPICE, ANSOFT-Maxwell 2D/3D, MATLAB, Tektronix IConnect, Agilent PLTS


References Available Upon Request