ERDEM MATOGLU
Assistant
Prof. Dr.
Istanbul Technical University
School of Computer Engineering and Informatics
ITU Ayazağa/Maslak
For contact
please visit:
www.linkedin.com/pub/erdem-matoglu/2/301/4bb/
EDUCATION
Ph.D., Electrical
Engineering, Georgia Institute of Technology, Atlanta, Georgia, May
2004, GPA: 3.76/4.00
Thesis: Statistical Design, Analysis, and Diagnosis of
Digital Systems and Embedded RF Circuits
MS, Electrical Engineering,
Georgia Institute of Technology,
Major: Electromagnetics and Electronic Design
BS, Electrical Engineering,
Major: Computer Architecture and Microelectronics
Dr. Erdem Matoglu received his MSc and PhD degrees from Georgia Institute of Technology. During his graduate studies he worked on electronic systems design and packaging issues of high-frequency digital and RF systems. He developed statistical methods to improve understanding and increase efficiency in the design of high data rate computer interfaces. Following graduation he joined IBM Systems and Technology Division x-Series Server Development Group in Austin, TX. He worked there for five years, taking part in Intel and AMD based IBM x-Series server designs. He implemented the results of his PhD dissertation on the signal integrity and power integrity issues of high frequency interfaces, resulting in improvements in design cycle and product quality. As a result of his work and the patents he contributed, he was promoted to Senior Engineer/Scientist and reached the 3th IBM Invention plateau. The statistical practices he published are currently implemented by IBM, Intel, Dell, and AMD signal and power integrity design engineering.
In 2009 he moved to Istanbul and joined Hittite Microwave Corporation Istanbul Design Center, at the ITU Technopark. At Hittite, his research was on RF and digital transmission technology. Some of the research projects he completed include development of modelling techniques for LNA noise parameters, implementation of quadrature modulation test boards and methodologies, and improvements on wideband power detector sensitivity.
In 2011and 2012, he taught at the Istanbul Technical University, School of Computing and Informatics.
In August 2012, he joined Amphenol Corporation,
High Speed Interconnects Division in Nashua, New Hampshire, USA.
Research Interests:
·
High-frequency digital data transmission
in copper, fiber-optic, and wireless environments
·
Signal Integrity and Power Integrity
issues of high-frequency digital systems
·
Implementation of high-frequency digital
and RF systems
EXPERIENCE
08/2012 – Present Amphenol
Corporation, Nashua, NH, USA
Senior Signal Integrity
Engineer
Design, development, and manufacturing of high speed
cable, connector, backplane solutions for 100G Ethernet, Infiniband
FDR & EDR, Fibre Channel, Serial Attached SCSI
09/2011 – 07/2012 Istanbul
Technical University, School of Computer Engineering and Informatics
Assistant Prof. Dr.
02/2009 – 08/2011 Hittite
Microwave Corporation (NASDAQ:HITT), Istanbul Design Center
Senior Engineer
Working on development, bring-up, test, and verification of digital and
RF hardware components for wireless and fiber-optic communication technologies
- Developed engineering solutions for
digital, RF, and mixed signal system challenges.
- Worked on development, bring-up, test and
verification of up/down conversion components, modulators, de-modulators,
mixers, LNA’s, variable attenuators, power detectors, fiber-optic laser
modulator drivers, and fiber-optic clock chain applications.
- Designed digital calibration hardware for
quadrature modulator products.
- Designed extended range power detector
modules.
- Designed fiber-optic modulator driver, and
clock chain modules.
- Prepared implementation and user
documentations to support complex products and systems
- Provided engineering support to customers,
business development, and sales teams to increase revenue and market share
02/2004 – 01/2009 IBM
Corporation,
Senior Engineer, Systems &Technology Group, System x Server Development
Worked in the design and development of high performance IBM server
systems
- Responsible for signal and power integrity
of the electrical interfaces for IBM System x products at package and
board level
- Verified electrical specification compliance
through design and measurements
- Conducted feasibility and interface
performance analysis for the concept designs
- Generated physical implementation
guidelines
- Directed physical board and electronic
package designs of the computer system
- Derived design guidelines of critical
electrical interfaces for Intel and AMD based high-end System x and BladeCenter servers
- Involved in the design and development of
IBM System x servers: x3755, x3655, x3455, x260, x360, x460, x366, and BladeCenter server systems
- Worked on the implementation of processor
interfaces: HyperTransport and FSB; Memory
interfaces: DDR, DDR2, and FBD; Storage interfaces: SAS and SATA;
Peripheral interfaces: PCIE and PCIX; Scalability interfaces: IBM HSS
- Developed statistical analysis and diagnosis
methods to evaluate high-speed electrical performance, find worst-case
corners, and optimize the design
- Worked on power delivery design,
decoupling capacitor optimization, simultaneous switching noise reduction
for electronic components
- 8 US Patents and 3 internal IBM
publications
08/1999 - 12/2003
Research Assistant,
- Developed statistical methodologies
relating manufacturing variations of printed circuit board and packaging structures
to electrical signal and power integrity performance
- Designed high-speed source synchronous
test boards for transmission, bandwidth, and signal integrity research
- Developed and optimized models, simulations,
and measurements for electrical characterization of chip and system level
packages
05/2002 - 08/2002 IBM
Corporation,
Co-op Assignment
- Worked on power and signal integrity
modeling, simulation, verification, and measurement of IBM System x server
memory cards and PCI-X ports
- Developed and implemented a statistical
approach for signal integrity analysis and failure diagnosis
- Participated in development and hardware
de-bugging
05/2001 - 08/2001 IBM
Corporation,
Co-op Assignment
- Worked on signal and power integrity
modeling and simulation of IBM System x server Intel Front Side Bus
- Modeled and analyzed simultaneous
switching noise and power plane bounce
- Performed system level simulations to
optimize the amount and location of decoupling capacitors
- Simulated high frequency plane resonance
for large server boards
06/1998 - 08/1998
Internship VLSI Design Group
- Learned basic VLSI design
- Worked on analog CMOS sensor readout circuits
06/1997 - 08/1997 ASELSAN
Electronics Company, Electro-optics Division,
Internship
- Studied infrared imaging and various night
vision techniques
PUBLICATIONS AND AWARDS
- Co-inventor of 8 US Patents and 3 internal IBM
publications
- Authored and co-authored 34 IEEE indexed
publications
- Intel Best Student Paper Award at IEEE
EPEP 2002 Conference.
SKILLS
- Used various test and
measurement equipment for time and frequency domain characterization
Oscilloscopes,
Time Domain Reflectometry (TDR), Vector Network
Analyzer (VNA), Spectrum Analyzer, Signal Generators, etc…
- Engineering Software:
Cadence Allegro PCB Editor/Constraint Manager/SigXp,
HSPICE, ANSOFT-Maxwell 2D/3D, MATLAB, Tektronix IConnect,
Agilent PLTS
References Available Upon Request